High-resolution printing

Setting new standards in resolution,
aspect ratio and throughput

Holst Centre is continually pushing the boundaries of printed electronics technologies to open new frontiers and enable new promising applications. By taking the traditional Laser Induced Forward Transfer (LIFT) process to the next level, we are able to print high resolution (< 10 microns) and high aspect ratios (above 1) electronics at very high throughputs. The LIFT 2.0 technology has all the potential to revolutionise the current deposition technologies in semiconductor chip packaging and display use cases.

One of the current challenges in printed electronics is the large gap between the costly, high-resolution process based on lithography, and cost-effective, but also less refined printing technologies. There is a large number of application domains that require a higher resolution at affordable costs, for example for printing antennas and realizing Radio-frequency identification (RFID) tags, and LED displays. Aiming to fulfil this technology gap, Holst Centre has developed a new printing technology, based on traditional Laser Induced Forward Transfer (LIFT), a well-known and successful light-induced technique for micro-printing.

An array of conductive adhesive dot LIFT printed on a flexible film
LIFT 2.0

By pushing the resolution and aspect ratio, we created LIFT 2.0, which enables realization of a whole new range of high-resolution applications. With the display industry searching for new and innovative ways to increase display resolution, as well as to include new user interfaces into the full display area, high-resolution printing technology is a key enabler to realize these goals.

Our printing technique offers a state-of-the-art resolution of less than 10 microns, and high aspect ratios of more than 1. These characteristics are key for applications such as 5G, where you need high aspect ratios for a high power throughput. In all three areas – resolution, aspect ratio and throughput – LIFT 2.0 offers optimum performance.

40 µm dots of solder paste printed over 100 micron gap with LIFT 2.0 technology
High resolution and high-throughput printing

At Holst Centre we believe that high-resolution printing using LIFT 2.0 opens up new possibilities for various applications. High-throughput printing of fine interconnected patterns (<30microns) , for example, enables the integration of micro-LED displays.

New possibilities

At Holst Centre we believe high-resolution printing using LIFT 2.0 opens up new possibilities for various applications. For example, high-throughput printing of fine interconnected patterns (<30microns) enables integration of micro-LED displays.