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With feature sizes down to 10 µm, conductive tracks, vias and micro-components can be embedded directly within the printed dielectric matrix for fully integrated architectures. Sensors, antennas, passive components and interconnects can all be embedded into three-dimensional substrates. The combination of 3D microelectronics with other features – such as microfluidics for on-chip cooling in advanced packaging – has also been demonstrated. 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TNO at Holst Centre not only provides the equipment for such specialised and precise microelectronic manufacturing, but also the expertise to determine the programming, algorithms, software and materials knowledge to drive the next generation of electronic devices. 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Using patented foil-laminated stereolithography (f-SLA), fully integrated 3D electronic systems with conductive tracks, sensors, antennas, and cooling structures are produced in a single process. This enables high-resolution, compact, and high-performance devices for semiconductor, medical, space, and defence applications. Scalable, flexible, and sustainable manufacturing reduces material waste and accelerates development from digital design to functional device, unlocking next-generation electronics innovation.","2200-01-01 00:00","2000-01-01 00:00",{"id":15,"url":15,"linktype":89,"fieldtype":90,"cached_url":15},"3d-printed-microelectronics","en/r-d-domains/new-manufacturing-technologies/3d-printed-microelectronics",0,[],166820995037063,"b7d66da9-0f63-4c0b-b3ec-73f82bcba958","2026-05-14T09:37:28.151Z","default",[],[218],{"name":219,"id":220,"uuid":186,"slug":221,"url":187,"full_slug":187},"Contact",124781506877330,"contact",1781873781391]