Semiconductor industry is changing rapidly due to new applications in automotive and RF and next to this, there is also the upcoming field of integrated photonics. This leads to new challenges and opportunities both on the technology-side as well as on the application-side. In this session, some innovative new Holst Centre technologies and applications will be presented.

Topics:

• Lidar for automotive

• High-speed assembly using laser-based processes

• Challenges and opportunity for advanced packaging

Round 1: 14.15 - 15:00