Bayflex Solutions Unveils First Continuous Testing Lab in Europe at Holst Centre


Bayflex Solutions announced that it has signed a three-year agreement with Holst Centre to provide the latest generation of continuous testing solutions to accelerate development of the flexible electronics industries in Europe. Under the agreement Bayflex, the authorized representative of YUASA Systems in Europe, the Middle East and North America, will install several pieces of interchangeable YUASA endurance testing equipment at Holst Centre in Eindhoven, the Netherlands. The equipment will be used by both Holst Centre and its partners and by Bayflex Solutions.

Agreement

Under the agreement, Bayflex Solutions will continuously upgrade and expand its suite of test equipment that allows for precise mechanical testing of flexible and flexible-hybrid-electronics (FHE) devices and systems. Capabilities include flexing and stretching samples of various sizes, with tension-free™ mechanisms to isolate test characteristics. In addition, Holst Centre will have early access to Flexdata, an integrated software platform that enables multi-level data and image capture and analysis, automated lab robotics, and enables remote access and exchange of qualifying information with product developers and their suppliers.

Dr. Jeroen van den Brand, Research Manager at Holst Centre: “Emerging applications of printed and flexible electronics require not just flexibility, but also stretchability and conformability, to realize seamlessly integrated electronics. Holst Centre is at the forefront of innovations to enable next-gen electronics, and the partnership with Bayflex Solutions will give further impetus to our quest to make electronics as seamless and as integrated as possible.”

Eisuke Tsuyuzaki, Founder of Bayflex Solutions: “Bayflex Solutions is excited about this new relationship with Holst Centre, and to have the ability to support leading-edge FHE product and manufacturing development in Europe. As we emerge stronger from these covid times, it’s an important step forward to usher in what’s next in flexible electronics at scale.”