At imec at Holst Centre, integrated photonics is developed as a scalable platform for next-generation sensing and data-processing solutions. One example is solid-state LiDAR based on optical beamforming, where optical phased arrays replace mechanical scanning. By integrating lasers, beam steering and detection on a single chip, these systems become smaller, more stable and suitable for high-volume manufacturing. In parallel, imec explores applications such as speckle sensing for contactless health monitoring, combining photonic components with advanced algorithms to extract vital signs without physical contact. At the same time, imec works on the co-design of electronic and photonic chips (EIC and PIC) for applications such as data centres. These developments demonstrate how integrated photonics can deliver robust, precise and manufacturable solutions across industries.  

TNO at Holst Centre not only works on direct applications of integrated photonics technology but is also actively involved in developing the core technologies that make integrated photonics work. We build the next generation of photonic building blocks, working across two key material platforms – silicon nitride for low-loss signal transmission and fibre connectivity, and indium phosphide for high-speed modulators and laser arrays. We also bring these platforms together on a single substrate using heterogenous integration techniques enabled by glass interposer technology with polymer waveguides. 

In addition, we make photonic integrated circuits manufacturable at scale and enable advanced photonic packaging that bridges the gap between chip and real-world deployment. Underpinning it all is our expertise in wafer-level metrology that measures swiftly and accurately enough to keep pace with production. Through the Photonics Integration Technology Center (PITC) we share knowledge and accelerate industry adoption of these technologies.