Advanced integration technologies that combine high throughput with exceptional precision can significantly accelerate the deployment of integrated photonics, 3D assembly and semiconductor packaging. Adapted from technologies developed for rapid and selective microLED transfer in a new generation of displays, TNO at Holst Centre offers Laser-Induced Forward Transfer (LIFT) solutions that surpass conventional, contact-based component placement methods in advanced packaging.
Rapid, gentle component transfer
With LIFT, manufacturers can achieve faster, more selective component transfer with sub-micron precision and nanometre-scale motion control. LIFT is also compatible with 3D stacking workflows for high-density integration and advanced packaging. This non-contact, non-intrusive, gentle assembly process is uniquely suited to handle the thin, fragile and complex-shaped components that make up modern chip design. Components can be placed with sub-micron-level accuracy, ensuring reliable and rapid manufacturing. The entire process can take place directly within a front-end foundry, further reducing production time and risk of contamination.
Application-specific support
With this single technology, TNO at Holst Centre can offer a multitude of pre-industrialisation tools in the advanced packaging and semiconductor assembly domain. Beyond photonics, 3D integration and semiconductor packaging, the technology has already been adapted for the production of RFID chips, and further investigation will likely uncover new applications for this versatile platform.
Selective Micro-Patterning
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